The technical issues for innovative 3D packaging at the wafer level are close to being solved, according to a recent study of 3D IC and TSV technologies and markets by Yole Developpement. Portable applications are a strong market driver for 3D integration. Stacking memories, stacking memories and logic, image sensors with microprocessor and FPGAs will be the first mass market applications. In 2010, Yole forecasts that 1 billion Flash memories will be stacked with TSVs (through-Si vias).

Semiconductor chips face constant pressure for increased performances while still decreasing their size and at the same time their packages must be able to accommodate new functionalities. The ever-expanding consumer electronics market is a particularly strong driver of packaging innovations such as 3D ICs. Today wire bonding is limited in density and performances so 3D stacking with micro-vias (or TSV, “through-Si vias”) seems to be unavoidable in the future for miniaturization first and increased performances after.

According to Yole Developpment, 3D is the most "integrated" approach and is an enabling technology platform applicable to digital and mixed signal electronics, wireless, electro-optical, MEMS, sensors, smart imagers, displays and other devices.

There are, however, strong challenges. These include: thermal management, reliable co-design and simulation tools, industrial wafer-to-wafer bonding tools, low-cost through-wafer via structures and via fill processes.

About this study

The Yole Developpement report, "3D IC & TSV" (October 2007) by Dr. Eric Mounier, weighs the strength and weakness of existing 3D ICs technologies, and looks at who is doing what in terms of 3D packaging among the key players. The report highlights the market drivers for 3D packaging technologies, the status of developments, how it will impact the semiconductor food chain. It covers as well equipments market forecasts and technical analyses of the different solutions with extensive exclusive technical explanation, figures and abstracts.

Companies interviewed for this report include: 3D-Plus, All-via, Altera, AMD, Amkor, ASE, ASET, ASM International, Chartered Semiconductor, Dalsa Semiconductor, Dow Corning, E2V, Elpida Memories, EM Microelectronics, EVGroup, Fraunhofer IZM, Fraunhofer ISIT, Freescale, Fujikura, Fujitsu, Hymite, Hynix Semiconductor, IBM, IMEC, Infineon, Intel, Leti, Matsushita Electric Works, MEMSiC, Micron, MicroResist, MicroChem, Motorola, Nanya, NEC Electronics, Nokia, NXP, Oki, Philips Image Sensors, Philips Semiconductors, Powership, Qualcomm, Qimonda, Renesas, Rensselaer Polytechnic Institute, Samsung, Sanyo, Schott, Semitool, SensoNor, Sharp, Silex Microsystems, Sony, SPIL, STATSChipPac, STMicroelectronics, SÜSS microtec, Synova, Tessera, Texas Instruments, Tezzaron, Toshiba, Tohoku University, TSMC, VTI Technologies, VTT Technology, Xintec, XSil, Xilinx, Ziptronix, Zycube.

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